solder
英 ['s??ld?; 's?ld?]
美['sɑd?]
- vi. 焊接
- vt. 焊接；使聯(lián)接在一起
- n. 焊料；接合物
實(shí)用場(chǎng)景例句
- Fewer workers are needed to solder circuit boards...
- 焊接電路板需要的工人更少了。
柯林斯高階英語(yǔ)詞典
- He then soldered the wire to the telephone terminal...
- 接著他把電話線焊接到電話機(jī)上。
柯林斯高階英語(yǔ)詞典
- We should the adhibit of solder paste before screen printing by automatic machine or by hand.
- 我們?cè)谶M(jìn)行錫膏印刷前應(yīng)對(duì)錫膏進(jìn)行一定的檢測(cè).如果沒有專用設(shè)備也可以用以下的方法檢查一下.
期刊摘選
- PCBs are transported by a conveyor system over the preheat, solder and cooling stations.
- 電子線路板(PCB) 通過(guò)傳送系統(tǒng)經(jīng)過(guò)預(yù)熱, 焊接和冷卻區(qū)域.
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- Used with the solder wire together, soldering a stainless steel etc metal.
- 同錫線一起使用, 焊接不銹鋼等難以上錫的金屬.
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- Interface void damage is the failure characteristic of solder joint under temperature cycling.
- 溫度循環(huán)載荷可以在焊點(diǎn)界面處形成足以導(dǎo)致空洞損傷發(fā)生的高應(yīng)力三軸度.
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- Solder side is chosen to measure.
- 4量測(cè)以吃錫面為選擇點(diǎn).
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- Do the supplies use magnifying glass to full check PCB solder connections?
- 供應(yīng)商是否用放大鏡全面檢查PCB的焊點(diǎn)?
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- And techniques to make free solder bumping with electroplating are illustrated.
- 重點(diǎn)闡述了采用電鍍制作無(wú)鉛焊料凸點(diǎn)的方法.
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- Do not use any warming device to heat up the solder paste.
- 切忌用加熱工具對(duì)焊接材料進(jìn)行加熱.
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- It's easy to learn to make a perfect solder joint when you use NIBCO Fittings.
- 如果使用美國(guó)尼伯科管件,很容易學(xué)會(huì)進(jìn)行完美的焊料連接.
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- Hand solder is recommended instead of reflow solder.
- 不建議使用回流焊,推薦使用手動(dòng)焊接.
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- Then reheat the solder cup of the fitting to draw up the alloy.
- 然后重新加熱管件焊料杯口以吸入融合合金.
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- The second section will introduce the new slide valve and its application in Solder Paste process.
- 第二部分介紹最新的滑動(dòng)閥科技及其在點(diǎn)錫膏中的應(yīng)用.
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- Is the average and range of Solder Paste height measurements SPC controlled?
- 錫膏厚度測(cè)量的平均值和間距SPC是否受控?
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- Above two years solder sale experience.
- 兩年以上焊料銷售經(jīng)驗(yàn).
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- Titanium alloy solder bath : suitable for lead – free solder.
- 防腐蝕鈦合金爐膽: 適用無(wú)鉛工藝,壽命長(zhǎng). (先配項(xiàng))
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- No monitoring and control requirement on solder iron temperature.
- 對(duì)烙鐵溫度沒有要求監(jiān)測(cè)及控制.
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- Oxide occurring after melting approximately 50 % less than common solder.
- 熔解后氧化物(錫渣)之發(fā)生量較一般焊錫減低近半.
期刊摘選
- Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?
- 對(duì)錫膏厚度測(cè)量的平均值和間距是否定義了其控制上限和下限?
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- Careful tinning of the ends of wires results in a better joint when you solder them.
- 仔細(xì)對(duì)金屬絲末端進(jìn)行包錫有助于它們?cè)诤附訒r(shí)很好地結(jié)合.
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- The solder wire should attain the standard provision deflection and pitch by straightening.
- 焊絲經(jīng)校直應(yīng)達(dá)到標(biāo)準(zhǔn)規(guī)定的挺度和翹距.
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- Theoretical models are given to qualitatively explain the relationship between the solder joint volume and performance.
- 理論模型也定量給出了焊膏厚度與焊點(diǎn)性能之間的關(guān)系.
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- Is the time recorded when the solder paster is taken out from the storage case?
- 焊貼從存儲(chǔ)環(huán)境取出時(shí)的時(shí)間是否有記錄?
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- If too much solder is used, it may flow past tube stop and clog sealing area.
- 如果使用的焊料太多, 那么有些焊料可能會(huì)流過(guò)管道阻擋部位,并堵塞密封區(qū)域.
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- Block incoming electrical solder joints with different samples!
- 來(lái)料電機(jī)座的焊點(diǎn)與樣品不同!
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- So it will result in rigidity skin & block and solder balls etc.
- 產(chǎn)生的后果是:錫膏出現(xiàn)硬皮 、 硬塊、難熔并產(chǎn)生大量錫球等.
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